Numerically controlled
Machine tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine tools working by removing metal or cermets, not elsewhere specified or included: > Other: > Numerically controlled
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Subheadings
Products classified under HTS 8461.90.30
Makino S33 Vertical Machining Center
A numerically controlled vertical machining center designed for high-precision milling and drilling of metal parts in semiconductor manufacturing. It removes metal or cermets through CNC-controlled spindles and axes, fitting under 8461.90.30 as a machine tool for shaping and finishing not specified elsewhere. Used for fabricating precision components like wafer handling fixtures.
DMG Mori NLX 2500 CNC Lathe
Numerically controlled lathe for turning and shaping cylindrical metal components used in semiconductor equipment. Performs precision metal removal operations on cermet materials for parts like spindle shafts, classified in 8461.90.30 as other CNC machine tools working by removing metal.
Haas VF-2 4-Axis CNC Mill
Compact 4-axis numerically controlled milling machine for contouring and slotting metal blocks into semiconductor chamber parts. Removes material from metals and cermets via high-speed spindles, falling under 8461.90.30 for other numerically controlled machine tools.
Okamoto ACC-63DX CNC Surface Grinder
Numerically controlled surface grinder for finishing flat metal surfaces on semiconductor tooling bases to micron tolerances. Works by abrasive metal removal from cermets, classified as other CNC machine tools in 8461.90.30.
GF Machining Solutions Mikron HSM 500
High-speed milling CNC machine numerically controlled for complex 3D contouring of hardened metal molds used in semiconductor packaging. Removes metal and cermets through advanced toolpaths, under 8461.90.30 as unspecified CNC metalworking tools.
Doosan Puma 2100 CNC Turning Center
Numerically controlled twin-turret lathe for simultaneous metal removal from both ends of semiconductor vacuum chamber shafts. Classified in 8461.90.30 for other CNC tools working by removing metal or cermets.
Hermle C 250 U 5-Axis CNC Machining Center
5-axis numerically controlled machining center for complex shaping of monolithic metal blocks into semiconductor handler fixtures. Performs multi-angle metal and cermet removal, fitting 8461.90.30 as other numerically controlled machine tools.
Chevalier FSG-ADV1600 CNC Grinder
Numerically controlled double-column surface grinder for large metal baseplates used in semiconductor cleanroom equipment. Precision metal removal for flatness critical to wafer processing environments, under 8461.90.30.
Mazak Integrex i-200S Multi-Tasking CNC
Multi-tasking numerically controlled machine combining milling, turning, and drilling for complete semiconductor spindle assemblies from solid metal. Comprehensive metal/cermet removal capabilities classify it in 8461.90.30.
Wade 3020 CNC Wire EDM
Numerically controlled wire electrical discharge machine for cutting intricate slots in hardened metal semiconductor leadframes. Removes metal through electrical erosion process, classified under 8461.90.30 for other CNC metalworking tools.