Other
Machine tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine tools working by removing metal or cermets, not elsewhere specified or included: > Other: > Numerically controlled > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8461.90.30.80
Czochralski Crystal Puller
A numerically controlled machine used in semiconductor manufacturing to grow monocrystalline silicon boules by the Czochralski method, involving precise pulling and rotation of a seed crystal from molten silicon. It falls under HTS 8461.90.30.80 as a numerically controlled machine tool for material processing by removing excess material through grinding and shaping during boule formation. This equipment precisely shapes semiconductor crystal growth for subsequent wafer slicing.
Float Zone Crystal Grower
Numerically controlled apparatus employing the float zone method to produce high-purity silicon crystals by melting and reshaping a polycrystalline rod without a crucible. Classified in 8461.90.30.80 for its metal/cermet removal via zone refining and precise shaping in semiconductor wafer production. It removes impurities and shapes boules for slicing into wafers.
Crystal Boule Grinder
A CNC machine tool that grinds semiconductor crystal boules to precise diameters and flats indicating conductivity type and resistivity, as per statistical notes for wafer preparation. Under HTS 8461.90.30.80 as numerically controlled equipment working by removing cermet/semiconductor material. Essential for preparing boules before wafer slicing in chip fabrication.
Wafer Slicing Diamond Saw
Numerically controlled inner-diameter diamond saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Fits 8461.90.30.80 as NC sawing machine removing material for semiconductor wafer preparation per chapter notes. Ensures precise thickness for subsequent processing into devices.
Semiconductor Wafer Lapper
CNC lapping machine that flattens and thins semiconductor wafers to exact tolerances by abrading with loose abrasive slurry, critical for flatness in fabrication. Classified 8461.90.30.80 for numerically controlled metal/cermet removal in wafer prep per statistical notes. Prepares wafer surface for photolithography.
Double-Sided Wafer Polisher
Numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. HTS 8461.90.30.80 covers NC finishing tools removing cermet material per wafer processing notes. Vital for device fabrication yield.
NC Gear Finishing Machine for Wafer Indexers
Numerically controlled gear finishing machine used to precision-grind gears for high-accuracy wafer handling indexers in semiconductor equipment. Falls under 8461.90.30.80 as other NC machine tools for gear finishing by metal removal. Ensures sub-micron positioning in fab tools.
CNC Broaching Machine for Wafer Chucks
Numerically controlled broaching tool that cuts precise keyways and slots in semiconductor wafer chucks for vacuum or electrostatic holding. 8461.90.30.80 for NC broaching removing cermet/metal in semiconductor context. Enables flat, distortion-free wafer processing.
Precision Slotting Machine for Crystal Flats
NC slotting machine that cuts orientation flats on semiconductor crystal boules to denote resistivity and doping type accurately. Under 8461.90.30.80 as numerically controlled slotting tool for material removal in wafer prep. Critical for wafer identification in fabs.
CNC Shaping Machine for Wafer Carriers
Numerically controlled shaping machine that forms custom profiles on semiconductor wafer carriers and boats for cleanroom transport. 8461.90.30.80 for NC shaping by removing metal/cermet for semiconductor processing equipment parts. Maintains wafer integrity during handling.
NC Gear Cutting Machine for Stage Drives
Numerically controlled hobbing machine for cutting precision gears used in X-Y stages of wafer processing equipment. Classified 8461.90.30.80 as NC gear cutting tool removing metal for semiconductor tools. Achieves nanometer stage accuracy.
CNC Wafer Edge Profiling Grinder
Numerically controlled edge grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. 8461.90.30.80 for NC grinding finishing semiconductor wafers per statistical notes. Improves yield by reducing edge defects.
NC Crystal Annealing Furnace Shaper
Numerically controlled shaping attachment for forming strain-free surfaces on annealed semiconductor crystals via precision grinding. Falls under 8461.90.30.80 as NC finishing tool for cermet removal post-processing. Reduces thermal stress defects.
Precision NC Wafer Thinning Grinder
CNC back-grinding machine that uniformly thins semiconductor wafers to <50 microns while maintaining total thickness variation. 8461.90.30.80 for numerically controlled grinding in wafer preparation sequence. Enables 3D chip stacking.
CNC Slotter for Wafer Test Probes
Numerically controlled slotting machine that cuts precise grooves in probe cards and contacts for semiconductor wafer testing interfaces. Under 8461.90.30.80 as NC slotting for metal removal in semiconductor processing tooling. Ensures reliable electrical contact.