CNC Slotter for Wafer Test Probes

Numerically controlled slotting machine that cuts precise grooves in probe cards and contacts for semiconductor wafer testing interfaces. Under 8461.90.30.80 as NC slotting for metal removal in semiconductor processing tooling. Ensures reliable electrical contact.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+35.0%39.4%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪Germany4.4%+10.0%14.4%
🇯🇵Japan4.4%+10.0%14.4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8461.90Same rate: 39.4%

If non-NC slotters

Other slotting machines without numerical control under 8461.90.10.

9031.49Lower: 10% vs 39.4%

If complete test probe assemblies

Finished electrical test fixtures classify in Chapter 90.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include probe pitch accuracy data; distinguish from Chapter 90 testers; EAR registration for test tech

Related Products under HTS 8461.90.30.80

Czochralski Crystal Puller

A numerically controlled machine used in semiconductor manufacturing to grow monocrystalline silicon boules by the Czochralski method, involving precise pulling and rotation of a seed crystal from molten silicon. It falls under HTS 8461.90.30.80 as a numerically controlled machine tool for material processing by removing excess material through grinding and shaping during boule formation. This equipment precisely shapes semiconductor crystal growth for subsequent wafer slicing.

Float Zone Crystal Grower

Numerically controlled apparatus employing the float zone method to produce high-purity silicon crystals by melting and reshaping a polycrystalline rod without a crucible. Classified in 8461.90.30.80 for its metal/cermet removal via zone refining and precise shaping in semiconductor wafer production. It removes impurities and shapes boules for slicing into wafers.

Crystal Boule Grinder

A CNC machine tool that grinds semiconductor crystal boules to precise diameters and flats indicating conductivity type and resistivity, as per statistical notes for wafer preparation. Under HTS 8461.90.30.80 as numerically controlled equipment working by removing cermet/semiconductor material. Essential for preparing boules before wafer slicing in chip fabrication.

Wafer Slicing Diamond Saw

Numerically controlled inner-diameter diamond saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Fits 8461.90.30.80 as NC sawing machine removing material for semiconductor wafer preparation per chapter notes. Ensures precise thickness for subsequent processing into devices.

Semiconductor Wafer Lapper

CNC lapping machine that flattens and thins semiconductor wafers to exact tolerances by abrading with loose abrasive slurry, critical for flatness in fabrication. Classified 8461.90.30.80 for numerically controlled metal/cermet removal in wafer prep per statistical notes. Prepares wafer surface for photolithography.

Double-Sided Wafer Polisher

Numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. HTS 8461.90.30.80 covers NC finishing tools removing cermet material per wafer processing notes. Vital for device fabrication yield.