CNC Slotter for Wafer Test Probes from Japan
Numerically controlled slotting machine that cuts precise grooves in probe cards and contacts for semiconductor wafer testing interfaces. Under 8461.90.30.80 as NC slotting for metal removal in semiconductor processing tooling. Ensures reliable electrical contact.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include probe pitch accuracy data; distinguish from Chapter 90 testers; EAR registration for test tech