Czochralski Crystal Puller
A numerically controlled machine used in semiconductor manufacturing to grow monocrystalline silicon boules by the Czochralski method, involving precise pulling and rotation of a seed crystal from molten silicon. It falls under HTS 8461.90.30.80 as a numerically controlled machine tool for material processing by removing excess material through grinding and shaping during boule formation. This equipment precisely shapes semiconductor crystal growth for subsequent wafer slicing.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If not numerically controlled
Non-NC versions of semiconductor processing machines fall under machines for semiconductor manufacture not elsewhere specified.
If primarily for testing grown crystals
If the primary function shifts to testing semiconductor devices rather than growth/processing, it moves to Chapter 90 test equipment.
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Import Tips & Compliance
• Verify numerical control certification and provide detailed technical specs for customs classification; ensure compliance with semiconductor export controls like Wassenaar Arrangement; common pitfall is misclassifying as testing equipment under Chapter 90
Related Products under HTS 8461.90.30.80
Float Zone Crystal Grower
Numerically controlled apparatus employing the float zone method to produce high-purity silicon crystals by melting and reshaping a polycrystalline rod without a crucible. Classified in 8461.90.30.80 for its metal/cermet removal via zone refining and precise shaping in semiconductor wafer production. It removes impurities and shapes boules for slicing into wafers.
Crystal Boule Grinder
A CNC machine tool that grinds semiconductor crystal boules to precise diameters and flats indicating conductivity type and resistivity, as per statistical notes for wafer preparation. Under HTS 8461.90.30.80 as numerically controlled equipment working by removing cermet/semiconductor material. Essential for preparing boules before wafer slicing in chip fabrication.
Wafer Slicing Diamond Saw
Numerically controlled inner-diameter diamond saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Fits 8461.90.30.80 as NC sawing machine removing material for semiconductor wafer preparation per chapter notes. Ensures precise thickness for subsequent processing into devices.
Semiconductor Wafer Lapper
CNC lapping machine that flattens and thins semiconductor wafers to exact tolerances by abrading with loose abrasive slurry, critical for flatness in fabrication. Classified 8461.90.30.80 for numerically controlled metal/cermet removal in wafer prep per statistical notes. Prepares wafer surface for photolithography.
Double-Sided Wafer Polisher
Numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. HTS 8461.90.30.80 covers NC finishing tools removing cermet material per wafer processing notes. Vital for device fabrication yield.
NC Gear Finishing Machine for Wafer Indexers
Numerically controlled gear finishing machine used to precision-grind gears for high-accuracy wafer handling indexers in semiconductor equipment. Falls under 8461.90.30.80 as other NC machine tools for gear finishing by metal removal. Ensures sub-micron positioning in fab tools.