Precision NC Wafer Thinning Grinder
CNC back-grinding machine that uniformly thins semiconductor wafers to <50 microns while maintaining total thickness variation. 8461.90.30.80 for numerically controlled grinding in wafer preparation sequence. Enables 3D chip stacking.
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Import Tips & Compliance
• Specify TTV specs (<0.5µm); tape-frame system documentation; pitfall: classifying as lapping equipment
Related Products under HTS 8461.90.30.80
Czochralski Crystal Puller
A numerically controlled machine used in semiconductor manufacturing to grow monocrystalline silicon boules by the Czochralski method, involving precise pulling and rotation of a seed crystal from molten silicon. It falls under HTS 8461.90.30.80 as a numerically controlled machine tool for material processing by removing excess material through grinding and shaping during boule formation. This equipment precisely shapes semiconductor crystal growth for subsequent wafer slicing.
Float Zone Crystal Grower
Numerically controlled apparatus employing the float zone method to produce high-purity silicon crystals by melting and reshaping a polycrystalline rod without a crucible. Classified in 8461.90.30.80 for its metal/cermet removal via zone refining and precise shaping in semiconductor wafer production. It removes impurities and shapes boules for slicing into wafers.
Crystal Boule Grinder
A CNC machine tool that grinds semiconductor crystal boules to precise diameters and flats indicating conductivity type and resistivity, as per statistical notes for wafer preparation. Under HTS 8461.90.30.80 as numerically controlled equipment working by removing cermet/semiconductor material. Essential for preparing boules before wafer slicing in chip fabrication.
Wafer Slicing Diamond Saw
Numerically controlled inner-diameter diamond saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Fits 8461.90.30.80 as NC sawing machine removing material for semiconductor wafer preparation per chapter notes. Ensures precise thickness for subsequent processing into devices.
Semiconductor Wafer Lapper
CNC lapping machine that flattens and thins semiconductor wafers to exact tolerances by abrading with loose abrasive slurry, critical for flatness in fabrication. Classified 8461.90.30.80 for numerically controlled metal/cermet removal in wafer prep per statistical notes. Prepares wafer surface for photolithography.
Double-Sided Wafer Polisher
Numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. HTS 8461.90.30.80 covers NC finishing tools removing cermet material per wafer processing notes. Vital for device fabrication yield.