Precision NC Wafer Thinning Grinder from Mexico
CNC back-grinding machine that uniformly thins semiconductor wafers to <50 microns while maintaining total thickness variation. 8461.90.30.80 for numerically controlled grinding in wafer preparation sequence. Enables 3D chip stacking.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify TTV specs (<0.5µm); tape-frame system documentation; pitfall: classifying as lapping equipment