8461.90.30.80/Precision NC Wafer Thinning Grinder/Mexico

Precision NC Wafer Thinning Grinder from Mexico

CNC back-grinding machine that uniformly thins semiconductor wafers to <50 microns while maintaining total thickness variation. 8461.90.30.80 for numerically controlled grinding in wafer preparation sequence. Enables 3D chip stacking.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

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Import Tips

• Specify TTV specs (<0.5µm); tape-frame system documentation; pitfall: classifying as lapping equipment