8461.90.30.80/Precision NC Wafer Thinning Grinder/Japan

Precision NC Wafer Thinning Grinder from Japan

CNC back-grinding machine that uniformly thins semiconductor wafers to <50 microns while maintaining total thickness variation. 8461.90.30.80 for numerically controlled grinding in wafer preparation sequence. Enables 3D chip stacking.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify TTV specs (<0.5µm); tape-frame system documentation; pitfall: classifying as lapping equipment