Makino S33 Vertical Machining Center
A numerically controlled vertical machining center designed for high-precision milling and drilling of metal parts in semiconductor manufacturing. It removes metal or cermets through CNC-controlled spindles and axes, fitting under 8461.90.30 as a machine tool for shaping and finishing not specified elsewhere. Used for fabricating precision components like wafer handling fixtures.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.4% | +35.0% | 39.4% |
| 🇲🇽Mexico | 4.4% | +10.0% | 14.4% |
| 🇨🇦Canada | 4.4% | +10.0% | 14.4% |
| 🇩🇪Germany | 4.4% | +10.0% | 14.4% |
| 🇯🇵Japan | 4.4% | +10.0% | 14.4% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If primarily for milling semiconductor wafers
Wafer-specific grinders, lappers, and polishers fall under statistical provisions for semiconductor manufacturing machines.
If classified as semiconductor processing machine
Equipment solely for semiconductor device fabrication may shift to Chapter 84 machines for specific industries.
If used mainly for bending or notching
Different metalworking operations like bending have dedicated headings separate from shaping/slotting tools.
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Import Tips & Compliance
• Verify CNC control certification and numerical control documentation to confirm classification under 8461.90.30
• Include detailed technical specs showing metal/cermet removal capability to avoid misclassification as testing equipment
• Ensure EPA compliance for coolant systems common in machining centers
Related Products under HTS 8461.90.30
DMG Mori NLX 2500 CNC Lathe
Numerically controlled lathe for turning and shaping cylindrical metal components used in semiconductor equipment. Performs precision metal removal operations on cermet materials for parts like spindle shafts, classified in 8461.90.30 as other CNC machine tools working by removing metal.
Haas VF-2 4-Axis CNC Mill
Compact 4-axis numerically controlled milling machine for contouring and slotting metal blocks into semiconductor chamber parts. Removes material from metals and cermets via high-speed spindles, falling under 8461.90.30 for other numerically controlled machine tools.
Okamoto ACC-63DX CNC Surface Grinder
Numerically controlled surface grinder for finishing flat metal surfaces on semiconductor tooling bases to micron tolerances. Works by abrasive metal removal from cermets, classified as other CNC machine tools in 8461.90.30.
GF Machining Solutions Mikron HSM 500
High-speed milling CNC machine numerically controlled for complex 3D contouring of hardened metal molds used in semiconductor packaging. Removes metal and cermets through advanced toolpaths, under 8461.90.30 as unspecified CNC metalworking tools.
Doosan Puma 2100 CNC Turning Center
Numerically controlled twin-turret lathe for simultaneous metal removal from both ends of semiconductor vacuum chamber shafts. Classified in 8461.90.30 for other CNC tools working by removing metal or cermets.
Hermle C 250 U 5-Axis CNC Machining Center
5-axis numerically controlled machining center for complex shaping of monolithic metal blocks into semiconductor handler fixtures. Performs multi-angle metal and cermet removal, fitting 8461.90.30 as other numerically controlled machine tools.