Rebuilt Okamoto ACC-3224DX Wafer Grinder
A numerically controlled grinder rebuilt for precision grinding of semiconductor wafers to exact tolerances by removing cermet or metal material. Classified under HTS 8461.90.30.60 as used/rebuilt NC machine tool for material removal in semiconductor prep. Ensures flatness critical for wafer fabrication processes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If specifically for semiconductor wafer manufacturing
Statistical notes place wafer preparation grinders in 8479 for semiconductor equipment.
If configured for honing rather than grinding
Honing or lapping machines have separate provisions in 8460.
If primarily a used molding machine for cermets
Used machines for molding metal carbides shift to heading 8480.
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Import Tips & Compliance
• Provide crystal boule grinding specs and SEMI standards compliance certification
• Document rebuild process with before/after metrology reports to confirm used status
• Avoid pitfalls by labeling precisely for semiconductor use; may trigger special duties
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