Rebuilt Okamoto ACC-3224DX Wafer Grinder from Germany
A numerically controlled grinder rebuilt for precision grinding of semiconductor wafers to exact tolerances by removing cermet or metal material. Classified under HTS 8461.90.30.60 as used/rebuilt NC machine tool for material removal in semiconductor prep. Ensures flatness critical for wafer fabrication processes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide crystal boule grinding specs and SEMI standards compliance certification
• Document rebuild process with before/after metrology reports to confirm used status
• Avoid pitfalls by labeling precisely for semiconductor use; may trigger special duties