Rebuilt Okamoto ACC-3224DX Wafer Grinder from Japan
A numerically controlled grinder rebuilt for precision grinding of semiconductor wafers to exact tolerances by removing cermet or metal material. Classified under HTS 8461.90.30.60 as used/rebuilt NC machine tool for material removal in semiconductor prep. Ensures flatness critical for wafer fabrication processes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide crystal boule grinding specs and SEMI standards compliance certification
• Document rebuild process with before/after metrology reports to confirm used status
• Avoid pitfalls by labeling precisely for semiconductor use; may trigger special duties