Rebuilt Okamoto ACC-3224DX Wafer Grinder from Japan
A numerically controlled grinder rebuilt for precision grinding of semiconductor wafers to exact tolerances by removing cermet or metal material. Classified under HTS 8461.90.30.60 as used/rebuilt NC machine tool for material removal in semiconductor prep. Ensures flatness critical for wafer fabrication processes.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide crystal boule grinding specs and SEMI standards compliance certification
• Document rebuild process with before/after metrology reports to confirm used status
• Avoid pitfalls by labeling precisely for semiconductor use; may trigger special duties