8461.90.30.60/Rebuilt Okamoto ACC-3224DX Wafer Grinder/Japan

Rebuilt Okamoto ACC-3224DX Wafer Grinder from Japan

A numerically controlled grinder rebuilt for precision grinding of semiconductor wafers to exact tolerances by removing cermet or metal material. Classified under HTS 8461.90.30.60 as used/rebuilt NC machine tool for material removal in semiconductor prep. Ensures flatness critical for wafer fabrication processes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide crystal boule grinding specs and SEMI standards compliance certification

• Document rebuild process with before/after metrology reports to confirm used status

• Avoid pitfalls by labeling precisely for semiconductor use; may trigger special duties