8461.90.30.60/Rebuilt Wafer Lapping Machine NTC-82S/Japan

Rebuilt Wafer Lapping Machine NTC-82S from Japan

Used numerically controlled lapping machine for flattening semiconductor wafers to optical tolerances by cermet removal. HTS 8461.90.30.60 covers this rebuilt tool for other metalworking processes. Critical step after grinding in wafer preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Document lapping plate material and flatness specs (e.g

• <1μ)

• Obtain SEMI-GAS compatibility certification