8461.90.30.60/Rebuilt Wafer Lapping Machine NTC-82S/Germany

Rebuilt Wafer Lapping Machine NTC-82S from Germany

Used numerically controlled lapping machine for flattening semiconductor wafers to optical tolerances by cermet removal. HTS 8461.90.30.60 covers this rebuilt tool for other metalworking processes. Critical step after grinding in wafer preparation.

Duty Rate — Germany → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document lapping plate material and flatness specs (e.g

• <1μ)

• Obtain SEMI-GAS compatibility certification

Rebuilt Wafer Lapping Machine NTC-82S from Germany — Import Duty Rate | HTS 8461.90.30.60