8461.90.30.60/Rebuilt Wafer Lapping Machine NTC-82S/China

Rebuilt Wafer Lapping Machine NTC-82S from China

Used numerically controlled lapping machine for flattening semiconductor wafers to optical tolerances by cermet removal. HTS 8461.90.30.60 covers this rebuilt tool for other metalworking processes. Critical step after grinding in wafer preparation.

Duty Rate — China → United States

39.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

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Import Tips

• Document lapping plate material and flatness specs (e.g

• <1μ)

• Obtain SEMI-GAS compatibility certification