Other
Machines for preparing textile fibers; spinning, doubling or twisting machines and other machinery for producing textile yarns; textile reeling or winding (including weft winding) machines and machines for preparing textile yarns for use on the machines of heading 8446 or 8447: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Products classified under HTS 8445.90.00.00
Wafer Flatness Metrology Tool
Precision interferometer system measuring wafer bow, warp, and total thickness variation critical for fabrication readiness. HTS 8445.90.00.00 under wafer grinder/lapper/polisher notes.
Multi-Wire Wafer Slicing Saw
Advanced saw using multiple diamond-coated wires to simultaneously slice hundreds of wafers from a single boule, improving yield. Classified HTS 8445.90.00.00 statistical note (a)(ii)(B).
Chemical Wafer Etch Station
Automated station using wet chemical etching to remove damaged layer from wafer surfaces post-sawing/ grinding. HTS 8445.90.00.00 for wafer preparation.
Automated Wafer Handling Robot
Cleanroom robot transferring wafers between preparation process tools (sawing, grinding, polishing stations). Classified HTS 8445.90.00.00 as integral wafer prep equipment.
Crystal Ingot Notcher
Machine that cuts precise notches into semiconductor ingots to indicate crystal orientation for wafer slicing alignment. HTS 8445.90.00.00 as part of boule preparation equipment.
Semiconductor Wafer Cleaner
Automated wet bench station that cleans wafers post-grinding/ lapping using megasonic, brush, and chemical processes to remove particles before fab entry. HTS 8445.90.00.00 as wafer preparation equipment.
boule Inspection Scanner
Laser/X-ray scanner that maps defects and determines optimal cutting planes in semiconductor boules before slicing. Falls under HTS 8445.90.00.00 for wafer preparation equipment.
Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon in a crucible, employing the Czochralski method. It falls under HTS 8445.90.00.00 as other machinery for preparing fibers, analogous to preparing semiconductor crystal 'fibers' from raw material for subsequent wafer processing. This equipment is essential for semiconductor wafer manufacturing.
Float Zone Crystal Grower
Equipment that uses the float zone method to purify and grow monocrystalline semiconductor boules by melting a narrow zone of polycrystalline rod with RF heating. Classified in HTS 8445.90.00.00 as other machinery for producing 'yarn-like' semiconductor crystals from raw material, per statistical notes for wafer manufacturing.
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact diameter and grinds orientation flats indicating conductivity type and resistivity. Falls under HTS 8445.90.00.00 per statistical note (a)(ii)(A) for wafer preparation equipment in semiconductor processing.
Wafer Slicing Diamond Saw
High-precision inner-diameter saw with diamond blade used to slice ultra-thin wafers from monocrystalline semiconductor boules. Classified under HTS 8445.90.00.00 as wafer slicing saws per statistical note (a)(ii)(B) for semiconductor wafer manufacturing.
Semiconductor Wafer Lapper
Machine that uses loose abrasive slurry to lap both sides of semiconductor wafers simultaneously, achieving precise flatness for fabrication processes. HTS 8445.90.00.00 per statistical note (a)(ii)(C) for wafer grinders, lappers, and polishers.
Wafer Edge Grinder
Specialized grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. Falls under HTS 8445.90.00.00 as wafer preparation equipment for bringing wafers within dimensional tolerances.
Double-Sided Wafer Polisher
Chemical mechanical polishing (CMP) equipment that polishes both wafer surfaces simultaneously using polishing pads and slurry for mirror finish required in device fabrication. Classified HTS 8445.90.00.00 under statistical note for wafer polishers.
Wafer Thickness Grinder
Backside grinder that thins semiconductor wafers from typical 700μm to 50-100μm for advanced packaging applications. Classified under HTS 8445.90.00.00 for wafer preparation grinders.