Float Zone Crystal Grower
Equipment that uses the float zone method to purify and grow monocrystalline semiconductor boules by melting a narrow zone of polycrystalline rod with RF heating. Classified in HTS 8445.90.00.00 as other machinery for producing 'yarn-like' semiconductor crystals from raw material, per statistical notes for wafer manufacturing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | 3.7% | +17.5% | 21.2% |
| š²š½Mexico | 3.7% | +10.0% | 13.7% |
| šØš¦Canada | 3.7% | +10.0% | 13.7% |
| š©šŖGermany | 3.7% | +10.0% | 13.7% |
| šÆšµJapan | 3.7% | +10.0% | 13.7% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the RF heating component is imported separately
Industrial/ lab electric induction furnaces classified by heating function in 8514.
If with integrated precision measurement for zone control
Measuring instruments for crystal parameters shift to Chapter 90.
If for non-wafer semiconductor material processing
General semiconductor manufacturing machines outside wafer prep notes go to 8479.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
ā¢ Include process flow diagrams showing integration into wafer fab prep line for proper HTS verification
ā¢ Label as 'semiconductor crystal growth equipment' to align with statistical note (a)(i)
Related Products under HTS 8445.90.00.00
Wafer Flatness Metrology Tool
Precision interferometer system measuring wafer bow, warp, and total thickness variation critical for fabrication readiness. HTS 8445.90.00.00 under wafer grinder/lapper/polisher notes.
Multi-Wire Wafer Slicing Saw
Advanced saw using multiple diamond-coated wires to simultaneously slice hundreds of wafers from a single boule, improving yield. Classified HTS 8445.90.00.00 statistical note (a)(ii)(B).
Chemical Wafer Etch Station
Automated station using wet chemical etching to remove damaged layer from wafer surfaces post-sawing/ grinding. HTS 8445.90.00.00 for wafer preparation.
Automated Wafer Handling Robot
Cleanroom robot transferring wafers between preparation process tools (sawing, grinding, polishing stations). Classified HTS 8445.90.00.00 as integral wafer prep equipment.
Crystal Ingot Notcher
Machine that cuts precise notches into semiconductor ingots to indicate crystal orientation for wafer slicing alignment. HTS 8445.90.00.00 as part of boule preparation equipment.
Semiconductor Wafer Cleaner
Automated wet bench station that cleans wafers post-grinding/ lapping using megasonic, brush, and chemical processes to remove particles before fab entry. HTS 8445.90.00.00 as wafer preparation equipment.