Chemical Wafer Etch Station
Automated station using wet chemical etching to remove damaged layer from wafer surfaces post-sawing/ grinding. HTS 8445.90.00.00 for wafer preparation.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | 3.7% | +17.5% | 21.2% |
| š²š½Mexico | 3.7% | +10.0% | 13.7% |
| šØš¦Canada | 3.7% | +10.0% | 13.7% |
| š©šŖGermany | 3.7% | +10.0% | 13.7% |
| šÆšµJapan | 3.7% | +10.0% | 13.7% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general chemical processing equipment
Centrifuges/ liquid processing machines.
If etching during device fabrication
Device manufacturing vs wafer prep.
If integrated wafer drying function dominant
Laboratory/ process drying ovens.
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Import Tips & Compliance
ā¢ Etch rate and uniformity specs required
ā¢ Chemical handling safety documentation
ā¢ Avoid general plating equipment classification
Related Products under HTS 8445.90.00.00
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boule Inspection Scanner
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