Chemical Wafer Etch Station from Mexico
Automated station using wet chemical etching to remove damaged layer from wafer surfaces post-sawing/ grinding. HTS 8445.90.00.00 for wafer preparation.
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Etch rate and uniformity specs required
• Chemical handling safety documentation
• Avoid general plating equipment classification