Chemical Wafer Etch Station from Mexico
Automated station using wet chemical etching to remove damaged layer from wafer surfaces post-sawing/ grinding. HTS 8445.90.00.00 for wafer preparation.
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Etch rate and uniformity specs required
• Chemical handling safety documentation
• Avoid general plating equipment classification