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8445.90.00.00/Chemical Wafer Etch Station/Japan

Chemical Wafer Etch Station from Japan

Automated station using wet chemical etching to remove damaged layer from wafer surfaces post-sawing/ grinding. HTS 8445.90.00.00 for wafer preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Etch rate and uniformity specs required

• Chemical handling safety documentation

• Avoid general plating equipment classification

Chemical Wafer Etch Station from Japan — Import Duty Rate | HTS 8445.90.00.00