Wafer Slicing Diamond Saw
High-precision inner-diameter saw with diamond blade used to slice ultra-thin wafers from monocrystalline semiconductor boules. Classified under HTS 8445.90.00.00 as wafer slicing saws per statistical note (a)(ii)(B) for semiconductor wafer manufacturing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | 3.7% | +20.0% | 23.7% |
| š²š½Mexico | 3.7% | +10.0% | 13.7% |
| šØš¦Canada | 3.7% | +10.0% | 13.7% |
| š©šŖGermany | Free | +10.0% | 10% |
| šÆšµJapan | Free | +12.5% | 12.5% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If configured for general metal/ stone sawing
Saw machines by material type; semiconductor specificity moves to 8445 notes.
If diamond saw blades imported separately
Saw blades/tools classified in Chapter 82, not complete machines.
If microtome-style for lab sample prep
Lab microscopes accessories including thin section cutters in 9017.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code ā and can price the duty on it in the same conversation.
Import Tips & Compliance
ā¢ Provide wafer thickness specifications (typically <1mm) and boule material compatibility certs
ā¢ Include cleanroom compatibility documentation for classification support
Related Products under HTS 8445.90.00.00
Wafer Flatness Metrology Tool
Precision interferometer system measuring wafer bow, warp, and total thickness variation critical for fabrication readiness. HTS 8445.90.00.00 under wafer grinder/lapper/polisher notes.
Multi-Wire Wafer Slicing Saw
Advanced saw using multiple diamond-coated wires to simultaneously slice hundreds of wafers from a single boule, improving yield. Classified HTS 8445.90.00.00 statistical note (a)(ii)(B).
Chemical Wafer Etch Station
Automated station using wet chemical etching to remove damaged layer from wafer surfaces post-sawing/ grinding. HTS 8445.90.00.00 for wafer preparation.
Automated Wafer Handling Robot
Cleanroom robot transferring wafers between preparation process tools (sawing, grinding, polishing stations). Classified HTS 8445.90.00.00 as integral wafer prep equipment.
Crystal Ingot Notcher
Machine that cuts precise notches into semiconductor ingots to indicate crystal orientation for wafer slicing alignment. HTS 8445.90.00.00 as part of boule preparation equipment.
Semiconductor Wafer Cleaner
Automated wet bench station that cleans wafers post-grinding/ lapping using megasonic, brush, and chemical processes to remove particles before fab entry. HTS 8445.90.00.00 as wafer preparation equipment.