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8445.90.00.00/Wafer Slicing Diamond Saw/Mexico

Wafer Slicing Diamond Saw from Mexico

High-precision inner-diameter saw with diamond blade used to slice ultra-thin wafers from monocrystalline semiconductor boules. Classified under HTS 8445.90.00.00 as wafer slicing saws per statistical note (a)(ii)(B) for semiconductor wafer manufacturing.

Duty Rate — Mexico → United States

13.7%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Provide wafer thickness specifications (typically <1mm) and boule material compatibility certs

• Include cleanroom compatibility documentation for classification support

Wafer Slicing Diamond Saw from Mexico — Import Duty Rate | HTS 8445.90.00.00