Wafer Slicing Diamond Saw from Japan
High-precision inner-diameter saw with diamond blade used to slice ultra-thin wafers from monocrystalline semiconductor boules. Classified under HTS 8445.90.00.00 as wafer slicing saws per statistical note (a)(ii)(B) for semiconductor wafer manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide wafer thickness specifications (typically <1mm) and boule material compatibility certs
• Include cleanroom compatibility documentation for classification support