Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon in a crucible, employing the Czochralski method. It falls under HTS 8445.90.00.00 as other machinery for preparing fibers, analogous to preparing semiconductor crystal 'fibers' from raw material for subsequent wafer processing. This equipment is essential for semiconductor wafer manufacturing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | 3.7% | +17.5% | 21.2% |
| š²š½Mexico | 3.7% | +10.0% | 13.7% |
| šØš¦Canada | 3.7% | +10.0% | 13.7% |
| š©šŖGermany | 3.7% | +10.0% | 13.7% |
| šÆšµJapan | 3.7% | +10.0% | 13.7% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If primarily used for laboratory testing of crystals
Lab analytical instruments for physical/chemical analysis fall under Chapter 90, not production machinery.
If for industrial semiconductor manufacturing machines not specifically wafer prep
Other unclassified machines for semiconductor manufacture may go to 8479 if outside textile fiber prep analogy.
If imported as complete semiconductor production plant sections
Machines for semiconductor production in assembled plant form classified under 8486.
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Import Tips & Compliance
ā¢ Verify classification under statistical notes for semiconductor wafer manufacturing equipment to avoid misclassification as general lab apparatus
ā¢ Provide detailed technical specs and end-use certificates proving use in crystal growth for boule slicing
Related Products under HTS 8445.90.00.00
Wafer Flatness Metrology Tool
Precision interferometer system measuring wafer bow, warp, and total thickness variation critical for fabrication readiness. HTS 8445.90.00.00 under wafer grinder/lapper/polisher notes.
Multi-Wire Wafer Slicing Saw
Advanced saw using multiple diamond-coated wires to simultaneously slice hundreds of wafers from a single boule, improving yield. Classified HTS 8445.90.00.00 statistical note (a)(ii)(B).
Chemical Wafer Etch Station
Automated station using wet chemical etching to remove damaged layer from wafer surfaces post-sawing/ grinding. HTS 8445.90.00.00 for wafer preparation.
Automated Wafer Handling Robot
Cleanroom robot transferring wafers between preparation process tools (sawing, grinding, polishing stations). Classified HTS 8445.90.00.00 as integral wafer prep equipment.
Crystal Ingot Notcher
Machine that cuts precise notches into semiconductor ingots to indicate crystal orientation for wafer slicing alignment. HTS 8445.90.00.00 as part of boule preparation equipment.
Semiconductor Wafer Cleaner
Automated wet bench station that cleans wafers post-grinding/ lapping using megasonic, brush, and chemical processes to remove particles before fab entry. HTS 8445.90.00.00 as wafer preparation equipment.