Wafer Edge Grinder Roller Assembly
Diamond roller assembly for beveling/rounding wafer edges to prevent chipping during handling and processing. For semiconductor wafer grinder equipment of heading 8430. Classifies 8431.49.90 other.
Import Duty Rates by Country of Origin
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as millstones/grinding wheels
Abrasive products of agglomerated synthetic materials classify in 6804 regardless of end use.
If for other lifting/handling machinery
Roller assemblies for handling equipment may go to 8428 if primary function is transport.
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Import Tips & Compliance
• Specify edge profile (1-5° bevel) and wafer diameter range
• Cleanroom particle specs mandatory
• Common error: abrasives under Chapter 68
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Semiconductor Wafer Slicing Diamond Saw Blade
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