Other
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8426, 8429 or 8430: > Other: > Other > Attachments for mounting on machinery: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8431.49.90.20
Float Zone Crystal Grower RF Coil
A radiofrequency induction coil attachment for float zone crystal growers (heading 8429 machinery) used to melt and purify silicon rods into monocrystalline boules for wafers. It mounts directly on the grower apparatus to create the molten zone. Classified under 8431.49.9020 as an other attachment for semiconductor processing machinery.
Semiconductor Wafer Edge Grinder Spindle
High-precision spindle attachment that mounts on wafer edge grinders (8429 machinery) to rotate and bevel wafer edges post-slicing for handling safety and yield improvement in semiconductor processing. Classified 8431.49.9020.
Crystal Puller Seed Holder Clip Assembly
Quartz or molybdenum clip assembly that mounts seed crystals in Czochralski pullers (8429) to initiate monocrystalline growth from molten silicon. Withstands 1400°C vacuum conditions. 8431.49.9020 attachment.
Wafer Grinder Coolant Nozzle Manifold
Stainless steel manifold attachment with multiple nozzles that mounts on wafer grinders/lappers (8429) to deliver deionized water coolant precisely during semiconductor wafer surface preparation. 8431.49.9020.
Boule Flattener Diamond Dresser Holder
Carbide holder attachment for mounting industrial diamond dressers on crystal boule flattener/grinders (8429 machinery) to create precise conductivity flats on semiconductor ingots. Ensures orientation accuracy. 8431.49.9020.
Wafer Polishing Head Vacuum Chuck
Porous ceramic vacuum chuck that mounts on polishing heads of wafer polishers (8429) to hold semiconductor wafers flat during final CMP preparation for device fabrication. Critical for nanometer flatness. 8431.49.9020.
Silicon Ingot Slicing Saw Wire Tensioner
Pneumatic tensioner attachment mounts on multi-wire wafer slicing saws (8429) to maintain diamond wire tension during high-speed slicing of silicon ingots into thousands of wafers simultaneously. 8431.49.9020.
Crystal Grinder Workhead Spindle Bearing
High-precision angular contact bearing assembly designed for workhead spindles on crystal grinders (8429) to support 5000+ RPM during semiconductor boule diameter reduction. Contamination-resistant. 8431.49.9020.
Wafer Lapper Planetary Gear Ring
Hardened steel internal gear ring attachment for planetary wafer lappers (8429) that drives multiple wafer carriers simultaneously across lapping plate for uniform semiconductor wafer thinning. 8431.49.9020.
Float Zone Furnace Seed Rotation Shaft
Tungsten or molybdenum shaft attachment that mounts in float zone furnaces (8429) to precisely rotate silicon seed rods during zone refining for ultra-pure semiconductor material growth. Withstands 2000°C. 8431.49.9020.
Wafer Thickness Gauging Sensor Mount
Aluminum precision mount that positions capacitive thickness sensors on wafer grinders (8429) for in-situ monitoring during semiconductor wafer thinning to ±0.5 micron tolerance. 8431.49.9020 attachment.
Czochralski Crystal Puller Heating Element
A high-temperature graphite or molybdenum heating element designed specifically for use in Czochralski crystal growers under HTS 8486.10, which are classified in heading 8429. It mounts inside the puller chamber to melt semiconductor materials like silicon for boule growth. This part falls under 8431.49.9020 as an attachment for mounting on semiconductor wafer manufacturing machinery.
Wafer Slicing Diamond Wire Guide
Precision ceramic or carbide guide attachment that mounts on wafer slicing saws (heading 8429) to tension and direct diamond-impregnated wire during kerfless slicing of silicon boules into wafers. Ensures uniform wafer thickness for semiconductor fabrication. Falls under 8431.49.9020 as an other mounting attachment.
Crystal Boule Grinder Collet Chuck
Adjustable collet chuck attachment that mounts on crystal grinders (heading 8429 equipment) to securely hold semiconductor boules during diameter grinding and flat notching for wafer preparation. Made of hardened steel or carbide. Classified in 8431.49.9020 as other machinery mounting attachment.
Wafer Lapping Plate Mounting Fixture
Aluminum or stainless steel fixture that attaches lapping plates to wafer grinder/polisher machines (heading 8429) for achieving flatness tolerances on semiconductor wafers prior to fabrication. Ensures parallel mounting. Under 8431.49.9020 as other attachment.