Other
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8426, 8429 or 8430: > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Subheadings
Products classified under HTS 8431.49.90
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafers. It is a part of crystal grower and puller machinery classified under heading 8429 as specialized ship unloading equipment adapted for semiconductor processing. Falls under 8431.49.90 as other parts for heading 8430 machinery.
Semiconductor Wafer Slicing Diamond Saw Blade
Precision diamond-impregnated saw blade designed for slicing monocrystalline semiconductor boules into thin wafers. Suitable solely for wafer slicing saws in semiconductor manufacturing equipment of heading 8430. Classified in 8431.49.90 as other parts.
Crystal Boule Grinder Spindle Assembly
High-precision spindle with diamond grinding wheel mount for grinding semiconductor crystal boules to exact wafer diameters and flats indicating resistivity. Part of crystal grinder equipment for heading 8430 semiconductor machinery. Other parts under 8431.49.90.
Wafer Lapping Plate for Semiconductor Polishers
Cast iron or copper lapping plate with colloidal slurry channels for flattening semiconductor wafers to nanometer tolerances before fabrication. Designed solely for wafer grinders, lappers, and polishers of heading 8430. Classifies as other parts in 8431.49.90.
Float Zone Crystal Grower RF Coil
Radio frequency induction coil for melting and zone-refining semiconductor material in float zone crystal growth systems. Principal part for crystal pullers under heading 8430 semiconductor equipment. Falls in 8431.49.90 other parts.
Semiconductor Wafer Grinder Vacuum Chuck
Porous ceramic vacuum chuck for holding 300mm silicon wafers during double-sided grinding to achieve parallelism tolerances. Solely for wafer grinder equipment of heading 8430. Other parts under 8431.49.90.
Crystal Boule Diameter Grinder Workhead
Precision workhead assembly with servo drive for grinding semiconductor boules to diameters from 150-450mm with 0.01mm tolerance. Part of crystal grinder machinery for heading 8430. Classifies 8431.49.90.
Wafer Polishing Head with Pad Holder
Carrier head with kinematic mounting for chemical mechanical planarization (CMP) pads used in final wafer polishing to angstrom-level flatness. For wafer polishers of heading 8430 semiconductor equipment. 8431.49.90 other parts.
Semiconductor Wafer Slicing Saw Spindle
High-speed air-bearing spindle for inner diameter wafer slicing saws, achieving kerf loss <20 microns per slice. Principal part for wafer slicing equipment under heading 8430. Other parts 8431.49.90.
Monocrystalline Boule Flattener Fixture
Custom fixture for grinding orientation flats on silicon/gallium arsenide boules to denote crystal plane and doping type. Used solely with crystal grinders of semiconductor machinery heading 8430. 8431.49.90.
Wafer Edge Grinder Roller Assembly
Diamond roller assembly for beveling/rounding wafer edges to prevent chipping during handling and processing. For semiconductor wafer grinder equipment of heading 8430. Classifies 8431.49.90 other.
Crystal Puller Seed Holder Chuck
Graphite or quartz seed crystal holder with rotation mechanism for initiating boule growth in Czochralski pullers. Essential part for crystal grower machinery under heading 8430. 8431.49.90.
Wafer Grinder Coolant Manifold
Precision-machined manifold distributing deionized coolant to wafer grinding zone, preventing thermal damage. For semiconductor wafer grinders/polishers of heading 8430. Other parts 8431.49.90.
Semiconductor Wafer Lapper Conditioning Ring
Diamond pellet conditioning ring for dressing lapping plates to maintain uniform wafer removal rates. Used exclusively with semiconductor wafer lappers of heading 8430 equipment. 8431.49.90.
Boule Puller Crucible Rotation Mechanism
Servo-driven rotation drive coupling crucible speed to pull rate for uniform silicon boule diameter in Czochralski systems. Principal part for crystal puller machinery heading 8430. Classifies 8431.49.90.