Other
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8426, 8429 or 8430: > Other: > Other > Other: > Other: > Other: > Other: > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8431.49.90.94
CMP Polisher Retaining Ring
Consumable retaining ring holding wafers in place during chemical-mechanical polishing for semiconductor devices.
Crystal Puller Seed Chuck Holder
Holder for seed crystal in Czochralski pullers initiating boule growth for semiconductor wafers.
Wafer Grinder Air Bearing
Air bearing spindle support for vibration-free grinding of semiconductor wafers.
Float Zone Puller Vacuum Chamber Lid
Sealable lid for vacuum chamber in float zone semiconductor crystal growth furnaces.
Czochralski Crystal Puller Furnace Chamber
The furnace chamber is a critical replaceable part for Czochralski crystal growers used in semiconductor wafer manufacturing, containing the high-temperature environment for pulling monocrystalline silicon boules. It falls under HTS 8431.49.90.94 as a part solely for machinery of heading 8429 (industrial ovens and furnaces). This statistical note component ensures precise crystal growth per semiconductor processing standards.
Float Zone Crystal Grower RF Heating Coil
RF heating coil used in float zone crystal pullers to melt and zone-refine semiconductor boules like silicon for ultra-pure wafers. Classified under HTS 8431.49.90.94 as a principal part for heading 8429 crystal growth furnaces in semiconductor manufacturing.
Semiconductor Crystal Boule Grinder Chuck
Precision vacuum chuck for holding crystal boules during grinding to exact wafer diameters, as per statistical note (a)(ii)(A) for wafer prep equipment. HTS 8431.49.90.94 covers it as a part for heading 8430 grinding machines dedicated to semiconductor processing.
Wafer Slicing Diamond Wire Guide
Diamond-impregnated wire guide for inner-diameter (ID) saws slicing semiconductor wafers from boules, per statistical note (a)(ii)(B). It's a part solely for heading 8430 wafer slicing saws, thus HTS 8431.49.90.94.
Silicon Wafer Lapping Plate
Cast iron or copper lapping plate for flattening semiconductor wafers to precise tolerances during wafer preparation, as in statistical note (a)(ii)(C). Classifies under HTS 8431.49.90.94 as part of heading 8430 lapping machinery for semiconductor use.
Semiconductor Wafer Polishing Head
Carrier head assembly for chemical-mechanical polishing (CMP) platens preparing wafer surfaces for device fabrication, per statistical note wafer polishers. HTS 8431.49.90.94 as part for heading 8430 polishing machines in semiconductor processing.
Crystal Grinder Flattening Fixture
Custom fixture for grinding flats on semiconductor crystal boules to indicate resistivity and type, statistical note (a)(ii)(A). Part of heading 8430 grinders, thus HTS 8431.49.90.94.
Wafer Slicing Coolant Nozzle Assembly
Precision nozzle directing coolant during diamond wire wafer slicing to minimize thermal damage, for heading 8430 saws per statistical note.
Boule Diameter Grinder Spindle
High-precision spindle for rotating crystal boules during diameter grinding in semiconductor prep equipment.
Wafer Edge Grinder Roller
Roller assembly for chamfering wafer edges post-slicing to prevent chipping in semiconductor processing.
Lapping Machine Slurry Distributor
Ring distributor evenly applying abrasive slurry on lapping plates for semiconductor wafer flattening.