Silicon Wafer Lapping Plate

Cast iron or copper lapping plate for flattening semiconductor wafers to precise tolerances during wafer preparation, as in statistical note (a)(ii)(C). Classifies under HTS 8431.49.90.94 as part of heading 8430 lapping machinery for semiconductor use.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

6804.10.00.00Same rate: 35%

If sold as millstones or grinding wheels without machine dedication

Abrasive articles not principally for specific 8430 machines classify in Chapter 68.

8431.39.00Same rate: 35%

If parts for general heading 8431 pumps or conveyors in wafer handling

If used in ancillary wafer transport systems, shifts within 8431 but different subheading.

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Import Tips & Compliance

Certify flatness specs (e.g

<1um) proving semiconductor application; include slurry compatibility details; avoid general abrasive plates under 6804