Other
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8428: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Subheadings
Products classified under HTS 8431.39.00
Seed Crystal Rotation Mechanism
Motorized mechanism that rotates the seed crystal at precise speeds during Czochralski pulling to ensure uniform boule diameter. Critical part for heading 8428 crystal growers. 8431.39.00 classification.
Wafer Bow Measurement Fixture
Fixture that holds wafers during bow/warp measurement in grinding process control stations. Designed for wafer grinder/polisher equipment of heading 8428. Parts in 8431.39.00.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafers. It is a part of crystal grower equipment classified under heading 8428 for other machinery of mineral substances. Falls under 8431.39.00 as a part solely for such semiconductor processing machinery.
Float Zone Crystal Grower
Apparatus employing the float zone method to produce ultra-pure monocrystalline semiconductor boules by melting and recrystallizing silicon rods. Classified as machinery of heading 8428 for semiconductor material processing. Its parts are under 8431.39.00 as other parts for such equipment.
Crystal Boule Grinder
Precision grinder for shaping semiconductor crystal boules to exact wafer diameters and grinding flats to indicate conductivity type. Part of wafer preparation equipment under heading 8428 machinery. Covered by 8431.39.00 for other parts of such semiconductor processing machines.
Semiconductor Wafer Slicing Diamond Saw
Diamond wire or blade saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules without damage. Essential wafer preparation machinery of heading 8428. Parts thereof are 'other' under 8431.39.00.
Wafer Lapping Machine Platen
Cast iron or composite platen for lapping semiconductor wafers to precise flatness before polishing. Part of wafer grinder/lapper/polisher under 8428 for semiconductor processing. Classified in 8431.39.00 as other parts.
Single-Side Wafer Polisher Head
Carrier head assembly that holds and polishes one side of semiconductor wafers to mirror finish for device fabrication. Part of wafer polishing equipment in heading 8428. Falls under 8431.39.00 for other such parts.
RF Coil Assembly for Float Zone Puller
Radio frequency induction coil assembly that creates the molten zone in float zone crystal growth systems. Specific part for heading 8428 semiconductor machinery. Included in 8431.39.00 as other parts.
Crystal Ingot Alignment Fixture
Precision fixture that aligns semiconductor crystal ingots before grinding or slicing operations. Designed solely for wafer preparation machinery of heading 8428. Parts classified under 8431.39.00.
Wafer Edge Profiling Tool
Tooling for grinding precise edge profiles on semiconductor wafers to prevent chipping during handling. Part of wafer grinding equipment under heading 8428. Covered by 8431.39.00.
Boule Handling Robot End-Effector
Vacuum or gripper end-effector customized for handling heavy semiconductor crystal boules between processing stations. Part principally for heading 8428 wafer manufacturing equipment. Under 8431.39.00.
Diamond Slurry Distribution Manifold
Manifold system that evenly distributes diamond slurry across wafer lapping/polishing platens in semiconductor prep equipment. Specific part for heading 8428 machinery. In 8431.39.00 category.
Crystal Growth Crucible Holder
High-purity graphite or quartz holder that positions the crucible precisely in Czochralski furnaces for silicon pulling. Essential part of crystal grower machines under 8428. Classified 8431.39.00.
Wafer Thickness Control Gauge Mount
Mounting fixture that positions in-process thickness gauges on wafer grinders for real-time feedback control. Part of semiconductor wafer preparation machinery of 8428. Under 8431.39.00.