Single-Side Wafer Polisher Head
Carrier head assembly that holds and polishes one side of semiconductor wafers to mirror finish for device fabrication. Part of wafer polishing equipment in heading 8428. Falls under 8431.39.00 for other such parts.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If incorporating optical profiling
Precision measuring machines with polishing functions go to 9031 per statistical notes.
If general semiconductor polishing machines
Some polishers classified directly under 8460 if not principally 8428-related.
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Import Tips & Compliance
• Provide polishing pad pressure specs and contamination controls; EPA rules for slurries
• Pitfall: dual classification with chapter 90 testing polishers
Related Products under HTS 8431.39.00
Seed Crystal Rotation Mechanism
Motorized mechanism that rotates the seed crystal at precise speeds during Czochralski pulling to ensure uniform boule diameter. Critical part for heading 8428 crystal growers. 8431.39.00 classification.
Wafer Bow Measurement Fixture
Fixture that holds wafers during bow/warp measurement in grinding process control stations. Designed for wafer grinder/polisher equipment of heading 8428. Parts in 8431.39.00.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafers. It is a part of crystal grower equipment classified under heading 8428 for other machinery of mineral substances. Falls under 8431.39.00 as a part solely for such semiconductor processing machinery.
Float Zone Crystal Grower
Apparatus employing the float zone method to produce ultra-pure monocrystalline semiconductor boules by melting and recrystallizing silicon rods. Classified as machinery of heading 8428 for semiconductor material processing. Its parts are under 8431.39.00 as other parts for such equipment.
Crystal Boule Grinder
Precision grinder for shaping semiconductor crystal boules to exact wafer diameters and grinding flats to indicate conductivity type. Part of wafer preparation equipment under heading 8428 machinery. Covered by 8431.39.00 for other parts of such semiconductor processing machines.
Semiconductor Wafer Slicing Diamond Saw
Diamond wire or blade saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules without damage. Essential wafer preparation machinery of heading 8428. Parts thereof are 'other' under 8431.39.00.