Single-Side Wafer Polisher Head from Germany
Carrier head assembly that holds and polishes one side of semiconductor wafers to mirror finish for device fabrication. Part of wafer polishing equipment in heading 8428. Falls under 8431.39.00 for other such parts.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide polishing pad pressure specs and contamination controls; EPA rules for slurries
• Pitfall: dual classification with chapter 90 testing polishers