Float Zone Crystal Grower
Apparatus employing the float zone method to produce ultra-pure monocrystalline semiconductor boules by melting and recrystallizing silicon rods. Classified as machinery of heading 8428 for semiconductor material processing. Its parts are under 8431.39.00 as other parts for such equipment.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the RF heating coil is imported separately for general use
RF generators and parts for semiconductor fab are in 8515, but only if not solely for 8428 machinery.
If for testing or measuring equipment
Measuring instruments for crystal properties shift to chapter 90, per statistical notes.
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Import Tips & Compliance
• Include manufacturer's declaration linking part to float zone systems for heading 8428; watch for dual-use claims
• Pitfall: incorrect valuation of RF coils as separate components
Related Products under HTS 8431.39.00
Seed Crystal Rotation Mechanism
Motorized mechanism that rotates the seed crystal at precise speeds during Czochralski pulling to ensure uniform boule diameter. Critical part for heading 8428 crystal growers. 8431.39.00 classification.
Wafer Bow Measurement Fixture
Fixture that holds wafers during bow/warp measurement in grinding process control stations. Designed for wafer grinder/polisher equipment of heading 8428. Parts in 8431.39.00.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafers. It is a part of crystal grower equipment classified under heading 8428 for other machinery of mineral substances. Falls under 8431.39.00 as a part solely for such semiconductor processing machinery.
Crystal Boule Grinder
Precision grinder for shaping semiconductor crystal boules to exact wafer diameters and grinding flats to indicate conductivity type. Part of wafer preparation equipment under heading 8428 machinery. Covered by 8431.39.00 for other parts of such semiconductor processing machines.
Semiconductor Wafer Slicing Diamond Saw
Diamond wire or blade saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules without damage. Essential wafer preparation machinery of heading 8428. Parts thereof are 'other' under 8431.39.00.
Wafer Lapping Machine Platen
Cast iron or composite platen for lapping semiconductor wafers to precise flatness before polishing. Part of wafer grinder/lapper/polisher under 8428 for semiconductor processing. Classified in 8431.39.00 as other parts.