Other
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8428: > Other > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8431.39.00.80
Wafer Thickness Gauging Fixture
Mechanical fixture integrating with grinders to monitor wafer thickness in-situ during backgrinding. Part of HTS 8431.39.0080 for 8428 wafer grinders. Maintains target thickness to ±1 micron.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in semiconductor manufacturing to grow monocrystalline silicon boules via the Czochralski method. It is a part specifically designed for crystal growers and pullers under heading 8428, fitting HTS 8431.39.0080 as other parts of semiconductor wafer manufacturing equipment. Essential for producing pure semiconductor crystals from which wafers are sliced.
Float Zone Crystal Growth Apparatus
Specialized equipment for float zone method to produce high-purity monocrystalline semiconductor boules without crucibles. Designed as a key component for wafer manufacturing machinery of heading 8428, classified under HTS 8431.39.0080. Critical for oxygen-free silicon crystals used in advanced semiconductors.
Semiconductor Crystal Grinder
Precision grinder for shaping crystal boules to exact wafer diameters and grinding flats indicating conductivity type. Falls under HTS 8431.39.0080 as other parts of heading 8428 wafer preparation equipment per statistical notes. Ensures precise geometry for subsequent wafer slicing.
Wafer Slicing Diamond Saw
High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules. Classified in HTS 8431.39.0080 as part of heading 8428 wafer preparation machinery. Maintains crystal integrity during high-volume wafer production.
Semiconductor Wafer Lapper
Lapping machine that uses loose abrasives to flatten semiconductor wafers to nanometer tolerances post-slicing. HTS 8431.39.0080 covers it as other wafer preparation parts for 8428 machinery per chapter notes. Prepares wafer surface for final polishing and fabrication.
Double-Sided Wafer Polisher
Equipment polishing both sides of semiconductor wafers simultaneously using chemical-mechanical planarization (CMP) pads. Fits HTS 8431.39.0080 as other parts of heading 8428 polishers for wafer prep. Achieves mirror finish for device fabrication.
Wafer Edge Profiling Tool
Precision tool for grinding and profiling wafer edges to prevent chipping during handling and processing. Part of heading 8428 wafer grinders, thus HTS 8431.39.0080. Ensures mechanical strength for 300mm+ wafers in fabs.
Crystal Boule Inspection Station
Automated station for grinding reference flats and inspecting boule resistivity/conductivity before slicing. HTS 8431.39.0080 as part of 8428 crystal grinders. Integrates grinding with non-destructive testing per statistical notes.
High-Purity Quartz Crucible
CVD-coated quartz crucible for containing molten silicon in Czochralski pullers. Essential part of heading 8428 crystal growers, HTS 8431.39.0080. Withstands 1700°C and minimizes impurities.
Wafer Grinding Spindle Assembly
Precision air-bearing spindle for wafer grinders ensuring sub-micron runout. Part of HTS 8431.39.0080 for heading 8428 machinery. Enables backgrinding to 50 micron thickness.
CMP Polishing Pad Conditioner
Diamond disk conditioner that dresses CMP pads between wafer polishing runs. HTS 8431.39.0080 as part for 8428 wafer polishers. Maintains pad planarity for consistent removal rates.
Wafer Carrier Ring
Consumable ceramic ring holding wafers during double-sided lapping/polishing operations. Fits HTS 8431.39.0080 for wafer prep equipment parts. Distributes pressure evenly across 12+ wafers.
Diamond Slurry Dispenser Nozzle
Precision nozzle array for uniform diamond slurry distribution in wafer lapping machines. Part of HTS 8431.39.0080 heading 8428 equipment. Controls particle flow for consistent material removal.
Boule Handling Vacuum Chuck
Vacuum chuck for secure handling of crystal boules during grinding operations. HTS 8431.39.0080 as part of 8428 crystal grinders. Prevents slippage with porous ceramic vacuum surface.