Wafer Slicing Diamond Saw
High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules. Classified in HTS 8431.39.0080 as part of heading 8428 wafer preparation machinery. Maintains crystal integrity during high-volume wafer production.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for gemstone or general sawing
Saws not dedicated to semiconductor wafers classify as thread/saw machinery.
If diamond saw blades sold separately
Individual consumable blades are tools under Chapter 82, not machinery parts.
If for semiconductor testing saws
Test wafer dicing saws may fall under Chapter 84 electro-mechanical apparatus.
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Import Tips & Compliance
• Provide evidence of diamond wire specs for semiconductor tolerances (e.g
• <50 micron kerf)
• Common issue: reclassification as jewelry saws under 8461
• Include cleanroom compatibility certification
Related Products under HTS 8431.39.00.80
Wafer Thickness Gauging Fixture
Mechanical fixture integrating with grinders to monitor wafer thickness in-situ during backgrinding. Part of HTS 8431.39.0080 for 8428 wafer grinders. Maintains target thickness to ±1 micron.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in semiconductor manufacturing to grow monocrystalline silicon boules via the Czochralski method. It is a part specifically designed for crystal growers and pullers under heading 8428, fitting HTS 8431.39.0080 as other parts of semiconductor wafer manufacturing equipment. Essential for producing pure semiconductor crystals from which wafers are sliced.
Float Zone Crystal Growth Apparatus
Specialized equipment for float zone method to produce high-purity monocrystalline semiconductor boules without crucibles. Designed as a key component for wafer manufacturing machinery of heading 8428, classified under HTS 8431.39.0080. Critical for oxygen-free silicon crystals used in advanced semiconductors.
Semiconductor Crystal Grinder
Precision grinder for shaping crystal boules to exact wafer diameters and grinding flats indicating conductivity type. Falls under HTS 8431.39.0080 as other parts of heading 8428 wafer preparation equipment per statistical notes. Ensures precise geometry for subsequent wafer slicing.
Semiconductor Wafer Lapper
Lapping machine that uses loose abrasives to flatten semiconductor wafers to nanometer tolerances post-slicing. HTS 8431.39.0080 covers it as other wafer preparation parts for 8428 machinery per chapter notes. Prepares wafer surface for final polishing and fabrication.
Double-Sided Wafer Polisher
Equipment polishing both sides of semiconductor wafers simultaneously using chemical-mechanical planarization (CMP) pads. Fits HTS 8431.39.0080 as other parts of heading 8428 polishers for wafer prep. Achieves mirror finish for device fabrication.