Wafer Slicing Diamond Saw from Mexico
High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules. Classified in HTS 8431.39.0080 as part of heading 8428 wafer preparation machinery. Maintains crystal integrity during high-volume wafer production.
Duty Rate — Mexico → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide evidence of diamond wire specs for semiconductor tolerances (e.g
• <50 micron kerf)
• Common issue: reclassification as jewelry saws under 8461
• Include cleanroom compatibility certification