High-Purity Quartz Crucible
CVD-coated quartz crucible for containing molten silicon in Czochralski pullers. Essential part of heading 8428 crystal growers, HTS 8431.39.0080. Withstands 1700°C and minimizes impurities.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If refractory crucibles generally
Non-semiconductor high-temp crucibles are Chapter 69 refractories.
If laboratory quartzware
Small-scale lab crucibles classify as scientific glass.
If coating materials only
Separate CVD coating compounds are Chapter 32 pigments.
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Import Tips & Compliance
• Declare opacity grade and coating type (SiO2 >99.999%) for classification
• Pitfall: lab glassware under 7017
• HTS license may needed for purity levels
Related Products under HTS 8431.39.00.80
Wafer Thickness Gauging Fixture
Mechanical fixture integrating with grinders to monitor wafer thickness in-situ during backgrinding. Part of HTS 8431.39.0080 for 8428 wafer grinders. Maintains target thickness to ±1 micron.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in semiconductor manufacturing to grow monocrystalline silicon boules via the Czochralski method. It is a part specifically designed for crystal growers and pullers under heading 8428, fitting HTS 8431.39.0080 as other parts of semiconductor wafer manufacturing equipment. Essential for producing pure semiconductor crystals from which wafers are sliced.
Float Zone Crystal Growth Apparatus
Specialized equipment for float zone method to produce high-purity monocrystalline semiconductor boules without crucibles. Designed as a key component for wafer manufacturing machinery of heading 8428, classified under HTS 8431.39.0080. Critical for oxygen-free silicon crystals used in advanced semiconductors.
Semiconductor Crystal Grinder
Precision grinder for shaping crystal boules to exact wafer diameters and grinding flats indicating conductivity type. Falls under HTS 8431.39.0080 as other parts of heading 8428 wafer preparation equipment per statistical notes. Ensures precise geometry for subsequent wafer slicing.
Wafer Slicing Diamond Saw
High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules. Classified in HTS 8431.39.0080 as part of heading 8428 wafer preparation machinery. Maintains crystal integrity during high-volume wafer production.
Semiconductor Wafer Lapper
Lapping machine that uses loose abrasives to flatten semiconductor wafers to nanometer tolerances post-slicing. HTS 8431.39.0080 covers it as other wafer preparation parts for 8428 machinery per chapter notes. Prepares wafer surface for final polishing and fabrication.