Wafer Edge Profiling Tool
Precision tool for grinding and profiling wafer edges to prevent chipping during handling and processing. Part of heading 8428 wafer grinders, thus HTS 8431.39.0080. Ensures mechanical strength for 300mm+ wafers in fabs.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general edge grinding machines
Non-precision edge grinders for metal/glass are Chapter 84 grinding tools.
If parts of bakery machinery
Edge trimmers with food-grade specs shift to other 8431 subheadings.
If consumable grinding wheels only
Interchangeable tooling classifies as Chapter 82 tools.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Certify edge bevel angles (e.g
• 4-degree laser edge) for semiconductor specificity
• Pitfall: dental grinders under 9018
• Include handling automation interface specs
Related Products under HTS 8431.39.00.80
Wafer Thickness Gauging Fixture
Mechanical fixture integrating with grinders to monitor wafer thickness in-situ during backgrinding. Part of HTS 8431.39.0080 for 8428 wafer grinders. Maintains target thickness to ±1 micron.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in semiconductor manufacturing to grow monocrystalline silicon boules via the Czochralski method. It is a part specifically designed for crystal growers and pullers under heading 8428, fitting HTS 8431.39.0080 as other parts of semiconductor wafer manufacturing equipment. Essential for producing pure semiconductor crystals from which wafers are sliced.
Float Zone Crystal Growth Apparatus
Specialized equipment for float zone method to produce high-purity monocrystalline semiconductor boules without crucibles. Designed as a key component for wafer manufacturing machinery of heading 8428, classified under HTS 8431.39.0080. Critical for oxygen-free silicon crystals used in advanced semiconductors.
Semiconductor Crystal Grinder
Precision grinder for shaping crystal boules to exact wafer diameters and grinding flats indicating conductivity type. Falls under HTS 8431.39.0080 as other parts of heading 8428 wafer preparation equipment per statistical notes. Ensures precise geometry for subsequent wafer slicing.
Wafer Slicing Diamond Saw
High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules. Classified in HTS 8431.39.0080 as part of heading 8428 wafer preparation machinery. Maintains crystal integrity during high-volume wafer production.
Semiconductor Wafer Lapper
Lapping machine that uses loose abrasives to flatten semiconductor wafers to nanometer tolerances post-slicing. HTS 8431.39.0080 covers it as other wafer preparation parts for 8428 machinery per chapter notes. Prepares wafer surface for final polishing and fabrication.