Wafer Edge Profiling Tool from Germany
Precision tool for grinding and profiling wafer edges to prevent chipping during handling and processing. Part of heading 8428 wafer grinders, thus HTS 8431.39.0080. Ensures mechanical strength for 300mm+ wafers in fabs.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Certify edge bevel angles (e.g
• 4-degree laser edge) for semiconductor specificity
• Pitfall: dental grinders under 9018
• Include handling automation interface specs