8431.39.00.80/Wafer Edge Profiling Tool/Japan

Wafer Edge Profiling Tool from Japan

Precision tool for grinding and profiling wafer edges to prevent chipping during handling and processing. Part of heading 8428 wafer grinders, thus HTS 8431.39.0080. Ensures mechanical strength for 300mm+ wafers in fabs.

Duty Rate — Japan → United States

15%

Rate breakdown

9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter

9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)

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Import Tips

• Certify edge bevel angles (e.g

• 4-degree laser edge) for semiconductor specificity

• Pitfall: dental grinders under 9018

• Include handling automation interface specs