8431.39.00.80/Wafer Edge Profiling Tool/Japan

Wafer Edge Profiling Tool from Japan

Precision tool for grinding and profiling wafer edges to prevent chipping during handling and processing. Part of heading 8428 wafer grinders, thus HTS 8431.39.0080. Ensures mechanical strength for 300mm+ wafers in fabs.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Certify edge bevel angles (e.g

• 4-degree laser edge) for semiconductor specificity

• Pitfall: dental grinders under 9018

• Include handling automation interface specs