8431.39.00.80/Wafer Edge Profiling Tool/China

Wafer Edge Profiling Tool from China

Precision tool for grinding and profiling wafer edges to prevent chipping during handling and processing. Part of heading 8428 wafer grinders, thus HTS 8431.39.0080. Ensures mechanical strength for 300mm+ wafers in fabs.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

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Import Tips

• Certify edge bevel angles (e.g

• 4-degree laser edge) for semiconductor specificity

• Pitfall: dental grinders under 9018

• Include handling automation interface specs