8431.39.00/Single-Side Wafer Polisher Head/Japan

Single-Side Wafer Polisher Head from Japan

Carrier head assembly that holds and polishes one side of semiconductor wafers to mirror finish for device fabrication. Part of wafer polishing equipment in heading 8428. Falls under 8431.39.00 for other such parts.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide polishing pad pressure specs and contamination controls; EPA rules for slurries

• Pitfall: dual classification with chapter 90 testing polishers

Single-Side Wafer Polisher Head from Japan — Import Duty Rate | HTS 8431.39.00