Silicon Wafer Lapping Plate from Japan
Cast iron or copper lapping plate for flattening semiconductor wafers to precise tolerances during wafer preparation, as in statistical note (a)(ii)(C). Classifies under HTS 8431.49.90.94 as part of heading 8430 lapping machinery for semiconductor use.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Certify flatness specs (e.g
• <1um) proving semiconductor application; include slurry compatibility details; avoid general abrasive plates under 6804