8431.49.90.94/Silicon Wafer Lapping Plate/Japan

Silicon Wafer Lapping Plate from Japan

Cast iron or copper lapping plate for flattening semiconductor wafers to precise tolerances during wafer preparation, as in statistical note (a)(ii)(C). Classifies under HTS 8431.49.90.94 as part of heading 8430 lapping machinery for semiconductor use.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Certify flatness specs (e.g

• <1um) proving semiconductor application; include slurry compatibility details; avoid general abrasive plates under 6804

Silicon Wafer Lapping Plate from Japan — Import Duty Rate | HTS 8431.49.90.94