Semiconductor Crystal Boule Grinder Chuck

Precision vacuum chuck for holding crystal boules during grinding to exact wafer diameters, as per statistical note (a)(ii)(A) for wafer prep equipment. HTS 8431.49.90.94 covers it as a part for heading 8430 grinding machines dedicated to semiconductor processing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8466.94.85Higher: 39.7% vs 35%

If for use with semiconductor-specific CNC grinding machines

Parts of heading 8466 machine tools for semiconductor material working take precedence over 8431.

8419.90.10.00Same rate: 35%

If part of laboratory-scale crystal processing ovens

Lab apparatus parts for semiconductor growth may classify under 8419 lab ovens.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include boule diameter tolerance specs (e.g

300mm) in invoices to confirm semiconductor specificity; ensure cleanroom compatibility certification; common pitfall is classifying as general lathe parts under 8467