Semiconductor Crystal Boule Grinder Chuck from Germany
Precision vacuum chuck for holding crystal boules during grinding to exact wafer diameters, as per statistical note (a)(ii)(A) for wafer prep equipment. HTS 8431.49.90.94 covers it as a part for heading 8430 grinding machines dedicated to semiconductor processing.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include boule diameter tolerance specs (e.g
• 300mm) in invoices to confirm semiconductor specificity; ensure cleanroom compatibility certification; common pitfall is classifying as general lathe parts under 8467