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Wafer Slicing Diamond Wire Guide

Diamond-impregnated wire guide for inner-diameter (ID) saws slicing semiconductor wafers from boules, per statistical note (a)(ii)(B). It's a part solely for heading 8430 wafer slicing saws, thus HTS 8431.49.90.94.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+50.0%50%
🇲🇽MexicoFree+25.0%25%
🇨🇦CanadaFree+25.0%25%
🇩🇪GermanyFree+15.0%15%
🇯🇵JapanFree+15.0%15%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8202.99.00.00Lower: 37.5% vs 50%

If supplied as consumable saw wire without machine fixture

Interchangeable tool blades separate from the machine classify as tools in heading 8202.

8479.89Lower: 15% vs 50%

If statistical note machines for semiconductor wafer prep

Dedicated parts for unlisted wafer processing machines shift to Chapter 84 semiconductor provisions.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Document wire tension and kerf specs matching statistical note wafer saws; declare diamond content for accurate valuation; pitfall: generic saw blades go to 8202