Wafer Slicing Diamond Wire Guide

Diamond-impregnated wire guide for inner-diameter (ID) saws slicing semiconductor wafers from boules, per statistical note (a)(ii)(B). It's a part solely for heading 8430 wafer slicing saws, thus HTS 8431.49.90.94.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8202.99.00.00Same rate: 35%

If supplied as consumable saw wire without machine fixture

Interchangeable tool blades separate from the machine classify as tools in heading 8202.

8479.89Lower: 12.5% vs 35%

If statistical note machines for semiconductor wafer prep

Dedicated parts for unlisted wafer processing machines shift to Chapter 84 semiconductor provisions.

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Import Tips & Compliance

Document wire tension and kerf specs matching statistical note wafer saws; declare diamond content for accurate valuation; pitfall: generic saw blades go to 8202