Wafer Slicing Diamond Wire Guide from Germany
Diamond-impregnated wire guide for inner-diameter (ID) saws slicing semiconductor wafers from boules, per statistical note (a)(ii)(B). It's a part solely for heading 8430 wafer slicing saws, thus HTS 8431.49.90.94.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Section 232: derivative steel (c)(xi), product of AR/EC/SV/GT/JP/KR/LI/CH/TW/GB/EU — 15%
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document wire tension and kerf specs matching statistical note wafer saws; declare diamond content for accurate valuation; pitfall: generic saw blades go to 8202