Wafer Slicing Diamond Wire Guide from Japan
Diamond-impregnated wire guide for inner-diameter (ID) saws slicing semiconductor wafers from boules, per statistical note (a)(ii)(B). It's a part solely for heading 8430 wafer slicing saws, thus HTS 8431.49.90.94.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document wire tension and kerf specs matching statistical note wafer saws; declare diamond content for accurate valuation; pitfall: generic saw blades go to 8202