Wafer Slicing Diamond Wire Guide from Canada
Diamond-impregnated wire guide for inner-diameter (ID) saws slicing semiconductor wafers from boules, per statistical note (a)(ii)(B). It's a part solely for heading 8430 wafer slicing saws, thus HTS 8431.49.90.94.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Document wire tension and kerf specs matching statistical note wafer saws; declare diamond content for accurate valuation; pitfall: generic saw blades go to 8202