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Semiconductor Wafer Polishing Head

Carrier head assembly for chemical-mechanical polishing (CMP) platens preparing wafer surfaces for device fabrication, per statistical note wafer polishers. HTS 8431.49.90.94 as part for heading 8430 polishing machines in semiconductor processing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+50.0%50%
🇲🇽MexicoFree+25.0%25%
🇨🇦CanadaFree+25.0%25%
🇩🇪GermanyFree+15.0%15%
🇯🇵JapanFree+15.0%15%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8428.90.03Lower: 40% vs 50%

If designed for wafer lifting/handling in cleanrooms

Lift/handling parts for fab equipment classify under heading 8428.

9031.49Lower: 12.5% vs 50%

If with integrated endpoint detection sensors

Polishing heads with measuring functions move to Chapter 90 testing apparatus.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Provide CMP process datasheets linking to statistical note polishers; declare pad pressure specs; common error: confusing with heading 8428 lifting gear heads